Microscale deformation behavior of bicrystal boundaries in pure tin (Sn) using micropillar compression - ScienceDirect

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Microscale deformation behavior of bicrystal boundaries in pure tin (Sn)  using micropillar compression - ScienceDirect
Deformation of µm- and mm-sized Fe2.4wt%Si single- and bi-crystals with a high angle grain boundary at room temperature - ScienceDirect
Microscale deformation behavior of bicrystal boundaries in pure tin (Sn)  using micropillar compression - ScienceDirect
Microscale deformation behavior of bicrystal boundaries in pure tin (Sn) using micropillar compression - ScienceDirect
Microscale deformation behavior of bicrystal boundaries in pure tin (Sn)  using micropillar compression - ScienceDirect
Size dependent strength, slip transfer and slip compatibility in nanotwinned silver - ScienceDirect
Microscale deformation behavior of bicrystal boundaries in pure tin (Sn)  using micropillar compression - ScienceDirect
PDF) Dislocation-twin boundary interaction in small scale Cu bi-crystals loaded in different crystallographic directions
Microscale deformation behavior of bicrystal boundaries in pure tin (Sn)  using micropillar compression - ScienceDirect
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Microscale deformation behavior of bicrystal boundaries in pure tin (Sn)  using micropillar compression - ScienceDirect
Intermetallic size and morphology effects on creep rate of Sn-3Ag-0.5Cu solder - ScienceDirect
Microscale deformation behavior of bicrystal boundaries in pure tin (Sn)  using micropillar compression - ScienceDirect
Deformation Twinning Arising in Single-Crystal, Bicrystal and Polycrystal on Commercially Pure Titanium Plate
Microscale deformation behavior of bicrystal boundaries in pure tin (Sn)  using micropillar compression - ScienceDirect
A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints - ScienceDirect
Microscale deformation behavior of bicrystal boundaries in pure tin (Sn)  using micropillar compression - ScienceDirect
OpenKIM · EAM Dynamo ZhouJohnsonWadley 2004NISTretabulation Al MO_060567868558_000 MO_060567868558 · Interatomic Potentials and Force Fields
Microscale deformation behavior of bicrystal boundaries in pure tin (Sn)  using micropillar compression - ScienceDirect
A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints - ScienceDirect
Microscale deformation behavior of bicrystal boundaries in pure tin (Sn)  using micropillar compression - ScienceDirect
Research Nuclear Materials Group
Microscale deformation behavior of bicrystal boundaries in pure tin (Sn)  using micropillar compression - ScienceDirect
PDF) Dislocation-twin boundary interaction in small scale Cu bi-crystals loaded in different crystallographic directions
Microscale deformation behavior of bicrystal boundaries in pure tin (Sn)  using micropillar compression - ScienceDirect
Stepwise work hardening induced by individual grain boundary in Cu bicrystal micropillars
Microscale deformation behavior of bicrystal boundaries in pure tin (Sn)  using micropillar compression - ScienceDirect
PDF) Dislocation-twin boundary interaction in small scale Cu bi-crystals loaded in different crystallographic directions
Microscale deformation behavior of bicrystal boundaries in pure tin (Sn)  using micropillar compression - ScienceDirect
Microscale deformation behavior of bicrystal boundaries in pure tin (Sn) using micropillar compression - ScienceDirect
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